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NEW Ciena Waveserver AI 3-Slot Interconnect Platform 1X 186-1010-900 2X 186-1032-900

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$24,955.00

Ciena Waveserver Ai 3-Slot Interconnect Platform Part Number: 186-1010-900Includes: Waveserver Ai Chassis with two 186-1032-900 slot filler (blank) panels Produc…

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Ciena Waveserver Ai 3-Slot Interconnect Platform

Part Number: 186-1010-900
Includes: Waveserver Ai Chassis with two 186-1032-900 slot filler (blank) panels

Product Description

The Ciena Waveserver Ai (186-1010-900) is a compact, high-density optical transport platform designed for data center interconnect (DCI), cloud networking, and high-capacity metro and long-haul applications. The platform leverages Ciena's WaveLogic Ai coherent optical technology to deliver scalable bandwidth, simplified deployment, and industry-leading power efficiency in a compact 1RU form factor. The modular architecture supports up to three service modules, enabling operators to scale capacity as needed while minimizing initial capital investment.

This configuration includes the 3-slot Waveserver Ai chassis with one active chassis assembly (186-1010-900) and two blank slot fillers (186-1032-900) installed in unused module bays to maintain proper airflow and thermal performance.


Technical Specifications

Specification Details
Manufacturer Ciena
Product Family Waveserver Ai
Part Number 186-1010-900
Product Type Modular Optical Interconnect Platform
Form Factor 1RU Rack-Mount Chassis
Module Bays 3 Service Module Slots
Slot Fillers Included 2 × 186-1032-900
Client Capacity Up to 24 × 100GbE (with three service modules installed)
Line Capacity Up to 2.4 Tbps
Per-Wavelength Capacity Up to 400 Gbps
Optical Technology WaveLogic Ai Coherent Optics
Network Applications DCI, Metro, Regional, Long-Haul
Fiber Capacity Up to 30.4 Tbps on flex-grid systems
Management Interfaces CLI, SNMP, REST API, NETCONF, gRPC, OpenConfig
Security TACACS+, ACL Support
Power Options Dual AC or Dual DC Redundant PSUs
AC Input Range 100–264 VAC
DC Input Range -40 to -72 VDC
Cooling Redundant Hot-Swappable Fan Modules
Operating Temperature 0°C to +40°C
Dimensions 1.75 in (44.45 mm) H × 17.48 in (444 mm) W × 22.99 in (584 mm) D

Key Features

  • Compact 1RU architecture for high-density deployments.
  • Supports up to three field-installable Waveserver service modules.
  • Delivers up to 2.4 Tbps of aggregate transport capacity.
  • WaveLogic Ai coherent technology for metro through ultra-long-haul applications.
  • Open APIs supporting automation and SDN integration.
  • Redundant power supplies and fan assemblies for carrier-grade reliability.
  • Pay-as-you-grow scalability with modular slot-based expansion.
  • Optimized for cloud, hyperscale, enterprise, and service provider interconnect applications.

Included Components

Part Number Description
186-1010-900 Waveserver Ai 3-Slot Interconnect Platform Chassis
186-1032-900 Waveserver Ai Slot Filler Blank (Qty 2)

The 186-1032-900 blank panels occupy unused module slots, ensuring proper airflow management and maintaining cooling efficiency until additional Waveserver Ai service modules are installed.


Typical Applications

  • Data Center Interconnect (DCI)
  • Cloud and Hyperscale Networking
  • Carrier Ethernet Transport
  • Metro Optical Networks
  • Long-Haul DWDM Networks
  • Enterprise Backbone Connectivity
  • High-Capacity Interconnect Services
 

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